3M™ Wafer De-Taping Tape 879, 210 mm x 100 m, 1 Roll/Case
- Part Number 879
- 3M ID 7010721890
- UPC 04548623456232
Details
Highlights
- Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
- Transparency allows for inspection without tape removal
- High instant adhesion to substrate
- Good holding power
3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Specifications
